It's for mobile and high tech electronic devices by connecting each x-layer made of fine circuits with laswer micro via to form a more complex and multifunctional wiring structure.
1. Capabilities :
* Stacked microvias ( plated copper ) and staggered microvias
* Cavities, countersunk holes or depth milling
* Solder resist in black, blue, green, etc.
* Low-halogen material in standard and high Tg range Low-Dk material for Mobile Devices
* All recognized printed circuit board industry surfaces available
2. Special Capabilities :
* Copper filling process
* Plated Over Via Filling
3. Application : Network / Military / Medical / Defense / Aerospace