Manufacture the board using low Dk/Df materials for high-speed, high-capacity data transmission and reception.
Innovative engineering and advanced process functions are applied to provide optimal solutions to customers.
1. Capabilities :
* Edge plating for shielding and ground connection
* High frequency base materials for applications up to 80GHz
* Cavities, countersunk holes or depth miling
* All recognized printed circuit board industry surfaces available
2. Special Capabilities :
* Differential surface finish
* Hybrid Material stack up
* Special material - Rogers, Taconics, Polyimide
3. Application :
* Automotive, Radar
* Defense / Aerospace electroics
* Medical devices and imaging equipments
* Complex telecommunications equipment